JPS6250064B2 - - Google Patents
Info
- Publication number
- JPS6250064B2 JPS6250064B2 JP1199781A JP1199781A JPS6250064B2 JP S6250064 B2 JPS6250064 B2 JP S6250064B2 JP 1199781 A JP1199781 A JP 1199781A JP 1199781 A JP1199781 A JP 1199781A JP S6250064 B2 JPS6250064 B2 JP S6250064B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- lsi
- terminal
- wiring
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 9
- 230000006866 deterioration Effects 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1199781A JPS57126156A (en) | 1981-01-29 | 1981-01-29 | Lsi substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1199781A JPS57126156A (en) | 1981-01-29 | 1981-01-29 | Lsi substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57126156A JPS57126156A (en) | 1982-08-05 |
| JPS6250064B2 true JPS6250064B2 (en]) | 1987-10-22 |
Family
ID=11793219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1199781A Granted JPS57126156A (en) | 1981-01-29 | 1981-01-29 | Lsi substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57126156A (en]) |
-
1981
- 1981-01-29 JP JP1199781A patent/JPS57126156A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57126156A (en) | 1982-08-05 |
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